The “EN IEC 60068-2-14 Environmental tests - Part 2-14: Tests - Test N: Temperature variation” standard, which is based on a European standard and subsequently published by the International Electrotechnical Commission (IEC), describes test methods involving specific ambient temperature changes to analyze their effects on samples.
Temperature variation testing is designed to determine the effect of temperature change or successive temperature changes on a sample. It is not designed to demonstrate the effects caused by low or high temperature exposure.
The effect of the change in temperature tests is determined by the following:
In the world of electronic and electromechanical products, reliability is a lifeline. From smartphones to industrial sensors, devices are constantly bombarded with environmental stressors, and few can be as insidious as rapid temperature fluctuations. The EN IEC 60068-2-14 standard is an international standard that tests the thermal resistance of a product.
This standard ensures that components, equipment, and assemblies can withstand real-world thermal fluctuations under pressure without cracking. It is part of the broader IEC 60068 series of standards, a comprehensive suite of environmental testing methods designed to simulate challenging conditions such as extreme cold, scorching heat, vibration, and more. This particular standard focuses on thermal shock, which are abrupt temperature changes that can cause materials to expand, contract, or degrade severely. Compliance with the EN IEC 60068-2-14 standard helps manufacturers avoid costly recalls and boost consumer confidence.
The EN IEC 60068-2-14 standard essentially evaluates how well a product withstands rapid changes in ambient temperature or a series of such changes. It's not about withstanding continuously high or low temperatures. Standards like IEC 60068-2-1 (cold) or IEC 60068-2-2 (dry heat) are relevant in that regard. Instead, it targets transition effects, i.e., stresses resulting from differential expansion, contraction, or cracking that occur when temperatures change rapidly.
When a circuit board fresh from a hot warehouse hits the back of a freezing truck, or a medical device rapidly moves from a sun-scorched ambulance to an air-conditioned emergency room, high temperature gradients are created within the device, especially near heat sources such as resistors. Radiation from one component can heat its neighbor while the rest remains cold, leading to microstresses that can break solder joints, warp printed circuit boards (PCBs), or loosen gaskets. This standard evaluates electrical and mechanical performance, material conformity, and overall structural integrity under these artificial stresses.
The main objectives of the EN IEC 60068-2-14 standard are as follows:
The EN IEC 60068-2-14 standard helps engineers assess risks and iterate on designs early by defining repeatable test methods with specified severity levels.
The EN IEC 60068-2-14 standard applies to a wide range of electrotechnical products: unpackaged components, complete assemblies, and even enclosed housings. It is ideal for electronic devices in the automotive, aerospace, consumer goods, and medical sectors. However, it is not an all-encompassing standard. Samples must represent operational use, and tests assume no power-on state unless otherwise specified (to isolate thermal effects).
This standard is not applicable solely to high/low temperature resistance or sealing integrity. It also does not apply to unpackaged products under vibration or other dynamic conditions unless combined with other IEC 60068 standard components.
The EN IEC 60068-2-14 standard includes two basic test variants (Na and Nb), each adapted to different shock intensities. The tests involve exposing the sample to controlled temperature cycles in ambient chambers and holding times to ensure stabilization. Exposure times vary depending on the sample type (e.g., heat-dissipating or non-heat-dissipating), but are calibrated to generate realistic stresses without unnecessary exaggerations.
The cycle profile is low-temperature stabilization, high-temperature transfer, stabilization, and re-transfer. Typically, 3-15 cycles are performed. The temperature changes by approximately 10-15 degrees per minute, mimicking natural daily fluctuations or storage-use transitions.
It is ideal for evaluating overall robustness in non-extreme scenarios, such as consumer electronics, in varying climates.
The cycling profile is similar to Na, but accelerated to up to 10 cycles, with rapid immersion for instantaneous shock. The cycling creates steeper slopes almost instantaneously via fluid transmission.
It simulates harsh conditions such as exposure under the hood of an automotive vehicle or sudden drops in altitude, similar to military equipment. Verification of fluid compatibility is required to prevent contamination.
Both methods measure sample temperature (not just room air) with accuracy, and tolerances are tightened in the latest version. Accuracy levels can be customized according to product specifications, but default values guarantee repeatability.
For many years, our organization, with its competent and experienced staff, has been understanding the needs of its clients, providing the advanced testing services they require, and assisting them in the establishment, implementation, and improvement of management systems. Within this framework, we also provide testing services to businesses in accordance with the “EN IEC 60068-2-14 Environmental tests - Part 2-14: Tests - Test N: Temperature change” standard.
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