IEC 60917-1 Modular Layout for Development of Mechanical Structures for Electrical and Electronic Equipment Applications - Part 1: General Standard

The IEC 60917-1 standard published by the International Electrotechnical Commission (IEC) describes the relationships between equipment applications and modular layout, which are applicable to the main structural dimensions of electronic and electrical equipment installed in various installations where dimensional interfaces for mechanical compatibility must be considered.

This standard also includes terms for mechanical parts and assemblies of electrical and electronic equipment to clarify the special relationships between equipment applications and modular layout. The latest update to this standard is a technical revision and includes the following important technical changes:

• Added new information on newly developed detail specifications of mechanical structures for electrical and electronic equipment applications.
• Added information on newly developed performance testing standards for verification of environmental performances and safety aspects and issues related to thermal performance and thermal management for electrical and electronic equipment applications.
• The relationships between the mechanical structure for the electrical and electronic system, the verification of environmental performance and safety considerations, and thermal performance and thermal management issues for electrical and electronic equipment applications are described.

Day by day, there is a constant trend towards higher functional integration and smaller electronic components and integrated circuits. In order for users to enjoy the technical and economic advantages of these new components and technologies during planning, design, manufacture and testing, equipment applications must meet certain requirements in terms of arranging products with minimal space and space loss.

For the purposes of this standard, the expression equipment application refers to the set of rules relating to the mechanical structure, modular layout, coordination dimensions, and the assembly areas to be used in multiple areas and equipment application, based on the mechanical structure for the enclosure and assembly of electrical, electronic and electromechanical systems.

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