ASTM D5470-12 Standard Test Method for Thermal Conduction Properties of Thermally Conductive Electrical Insulating Materials

ASTM D5470-12 Standard Test Method for Thermal Conduction Properties of Thermally Conductive Electrical Insulating Materials

The standard “ASTM D5470-12 Standard test method for thermal conductivity properties of thermally conductive electrical insulating materials” developed by the American Society for Testing and Materials (ASTM) describes a test method for measuring thermal impedance and calculating apparent thermal conductivity for thermally conductive electrical insulating materials ranging from liquid compounds to rigid solid materials.

ASTM D5470-12 Standard Test Method for Thermal Conduction Properties of Thermally Conductive Electrical Insulating Materials

The term thermal conductivity applies only to homogeneous materials. Thermally conductive electrical insulating materials are usually heterogeneous, and to avoid confusion this test method uses apparent thermal conductivity to determine the thermal conduction properties of both homogeneous and heterogeneous materials.

For the purposes of this standard, the following terms and definitions apply:

  • Apparent thermal conductivity expresses the time rate of heat flow per unit temperature gradient in the direction perpendicular to the area through a unit area of ​​a heterogeneous material under constant conditions.
  • The average temperature of a surface expresses the area-weighted average temperature.
  • A composite is a material composed of different parts that contribute proportionally or synergistically to the properties of the combination.
  • A homogeneous material is a material in which the relevant properties are not a function of location within the material.
  • Thermal impedance is the total resistance of a device (material, material interfaces) to heat flow.
  • Thermal interface resistance (contact resistance) is the temperature difference required to produce a unit of heat flux at the contact planes between the hot and cold surfaces and the sample surfaces in contact with the tested sample.
  • Thermal resistivity is the inverse of thermal conductivity. It is the temperature gradient perpendicular to the isothermal surface per unit heat flow under steady-state conditions.

The test method described here is based on the idealized heat conduction between two parallel, isothermal surfaces separated by a test specimen of uniform thickness. The thermal gradient imposed on the specimen by the temperature difference between the two contacting surfaces causes heat flow through the specimen. This heat flow is perpendicular to the test surfaces and is uniform across the surfaces, with no lateral heat spread.

When two measuring rods are used, the measurements required by this standard are:

  • T1: Hotter temperature of hot probe
  • T2: Colder temperature of hot probe
  • T3: Warmer temperature of cold probe
  • T4: Colder temperature of cold probe
  • A: Area of ​​test surfaces
  • D: Sample thickness

Based on the idealized test configuration, measurements are made to calculate the following parameters:

  • TH: Temperature of the hotter isothermal surface
  • TC: Temperature of the colder isothermal surface
  • Q: Heat flow rate between two isothermal surfaces
  • Thermal impedance: The temperature difference between two isothermal surfaces divided by the heat flow through them.
  • Apparent thermal conductivity: Calculated from the graph of sample thermal impedance versus thickness

There is an interface thermal resistance between the sample and the test surfaces. These contact resistances are included in the calculation of the sample thermal impedance. The contact resistance varies greatly depending on the structure of the sample surface and the mechanical pressure applied to the sample by the test surfaces. Therefore, the compressive pressure applied to the sample should be measured and recorded as a secondary measurement required by the method, except for fluid samples where the applied pressure is negligible. The thermal impedance calculation consists of the sum of the sample thermal resistance and the interface thermal resistance.

The calculation of apparent thermal conductivity requires accurate determination of the thickness of the test specimen. Depending on the material type, different tools can be used to control, monitor, and measure the test specimen thickness. If the size of the specimen may change during testing, the test specimen thickness can be controlled with wedges or mechanical stops. If the size of the specimen may change during testing, the test specimen thickness can be monitored during testing by in situ thickness measurement. The thickness of the test specimen may be measured as manufactured at room temperature in accordance with Test Method C of ASTM D374 if it exhibits negligible pressure deflection.

This standard measures the steady-state thermal impedance of electrical insulating materials used to enhance heat transfer in electrical and electronic applications. This standard is particularly useful for measuring the thermal conduction properties of samples that are very thin or do not have sufficient mechanical stability to permit temperature sensors to be placed in the sample, as in ASTM E1225.

This standard applies an idealized heat flow pattern and specifies an average specimen test temperature. Thermal impedances measured in this manner are not directly applicable to most practical applications where these necessary uniform, parallel heat conduction conditions are not present.

This standard is useful for measuring the thermal impedance of the following types of materials.

  • Type I: Viscous liquids that deform without limit when a stress is applied. These include liquid compounds such as greases, pastes, and phase change materials. These materials do not exhibit elastic behavior or a tendency to return to their original shape after the deflection stresses are removed.
  • Type II: Viscoelastic solids in which the deformation stresses are ultimately balanced by internal material stresses, thus limiting further deformation. For example, soft and hard rubber materials exhibit linear elastic properties with significant deviation with respect to material thickness.
  • Type III: Elastic solids that exhibit negligible deflection, such as ceramics, metals, and some types of plastics.

The apparent thermal conductivity of a sample can be calculated from the measured thermal impedance and the measured sample thickness if the interface thermal resistance is negligibly small (nominally less than 1 percent) compared to the thermal resistance of the sample. The apparent thermal conductivity of a sample material can be accurately determined by excluding the interface thermal resistance. This is accomplished by measuring the thermal impedance of different thicknesses of the material under test and plotting the thermal impedance against the thickness. The inverse of the slope of the resulting straight line is the apparent thermal conductivity. The intersection at zero thickness is the sum of the contact resistances at the two surfaces. The contact resistance of hard test specimens (Type III) can be reduced by applying thermal grease or oil to the test surfaces.

Our organization, which has been trying to support businesses from every sector with its testing, measurement, analysis and evaluation studies carried out in a wide range for years, has a strong staff that closely follows the developments in the world in the field of science and technology and constantly improves itself. In this context, testing services in accordance with the "ASTM D5470-12 Standard test method for thermal conductivity of electrical insulation materials" standard are also provided to businesses.

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