IPC-J-STD-002E Solderability Tests for Component Ends, Terminations, Lugs, Terminals and Wires

In the IPC-J-STD-002E standard published by the Printed Circuits Institute (IPC), a trade association established to standardize the assembly and production requirements of electronic equipment and assemblies, the solderability of electronic component leads, single wires, braided wires, lugs and nails is evaluated. A test method for This standard also includes defect definitions and acceptance criteria. It also provides a test method for the resistance of metallization to dissolution or wetting. This standard is designed to be used by both the supplier and the user.

Solderability assessments are made for the following purposes:

To verify that the solderability of component leads and terminations meets the requirements described in this standard.
To determine that storage has no adverse effect on the ability to solder components to an interconnected substrate.

Solderability determination is made during production activities, during user receipt of components, or just before assembly and soldering. To verify that metallized terminations will remain intact throughout assembly brazing processes, the resistance of the metallization assay to dissolution is determined.

The IPC-J-STD-002E standard describes methods by which component ends or terminations are evaluated for solderability.

Visual acceptance criteria tests include:

Test A: Solder bath/immersion and gaze test (leaded components and braided wires)
Test B: Solder bath/immersion and gaze test (lead-free components)
Test C: Wrapped wires test (lugs, tabs, hook ends and turrets)
Test D: Metallization test
Test S: Surface mount process simulation test
Test A1: Solder bath/immersion and gaze test (leaded components and braided wires)
Test B1: Solder bath/immersion and gaze test (lead-free components)
Test C1: Wrapped wires test (lugs, tabs, hook ends and turrets)
Test S1: Surface mount process simulation test

Force measurement tests are:

Test E: Wetting balance solder pot test, leaded components
Test F: Wetting balance solder pot test, lead-free components

Our organization, among the numerous test, measurement, analysis and evaluation studies it has given for businesses in various sectors, with its trained and expert staff and advanced technological equipment, within the scope of IPC-J-STD-002E standard, for component ends, terminations, lugs, terminals and wires. It also provides solderability testing services.