IPC-4204A Flexible Metal Clad Dielectrics For Use In Flexible Printed Circuit Manufacturing

IPC-4204A Flexible Metal Clad Dielectrics For Use In Flexible Printed Circuit Manufacturing

In the IPC-4204A standard published by the Printed Circuits Institute (IPC), a trade association established to standardize the assembly and production requirements of electronic equipment and assemblies, the classification system for flexible metal-clad dielectric materials used in the manufacture of flexible printed circuit boards and flexible flat cables, qualification and quality compliance requirements.

IPC-4204A Flexible Metal Clad Dielectrics For Use In Flexible Printed Circuit Manufacturing

The classification system describes flexible metal-clad dielectrics. The non-specific description is intended for use by designers in master drawings to indicate material selections. At the end of this standard is a set of material specification sheets identified by specification sheet numbers. Each page summarizes engineering and performance data for flexible metal-clad dielectrics and specifies base material type, adhesive type, and reinforcement method.

Example: IPC-4204/1

  • 1: It refers to the technical specification sheet showing the detail of copper-clad polyimide dielectric with acrylic adhesive. If more material specification details (such as dielectric, adhesive, or copper thicknesses) are required, these should be highlighted in cross-section views or notes on the master drawing.

The specific description should be in the form shown in the example below and is intended for use in manufacturers' material purchase orders. Because the description is lengthy and requires manufacturer-level knowledge when making detailed selections, the specific description should not be used by designers in master drawings to indicate material selections.

Örnek: IPC-4204/1 - E1E2M2/2 CU-W7-1P/1P

  • IPC-4202/1: Non-specific identification for unsupported flexible polyimide-based dielectrics
  • E: Base dielectric material type designation (indicates polyimide)
  • 1: Reinforcement method definition (indicates non-reinforced ones)
  • E: Reinforcement type designation, indicating the non-reinforced film
  • 2: Basic dielectric material thickness designation specifying 50 µm thickness
  • M: Adhesive type designation indicating acrylic adhesive
  • 2/2: Adhesive thickness designation specifying 50 micron thickness on both sides (not used for non-adhesive product)
  • CU-W7-1P/1P: metal plating designation indicating forged rolled annealed copper, both sides 35 micron untreated

Among the numerous test, measurement, analysis and evaluation studies it provides for businesses in various sectors, our organization also provides flexible metal-clad dielectrics testing services for use in the manufacture of flexible printed circuits, within the scope of the IPC-4204A standard, with its trained and expert staff and advanced technological equipment.

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