KIA ES90000-04 Alternative Bonding Material to Tin/Lead Alloy

Developed by Hyundai-Kia Motors, the oldest motor vehicle manufacturer in Korea, the “KIA ES90000-04 Tin/Lead Alloy Alternative Joining Material” standard outlines the test criteria and requirements to ensure the in-vehicle reliability of tin/lead alternative joining materials used in assembly components and connecting wires or terminals of Hyundai-Kia automotive electrical/electronic products. This tin/lead alloy alternative joining material is briefly referred to as “lead-free.”

This specification applies to all automotive electronic packaging and assembly processes using lead-free solder. However, if instructions differing from those in this specification are required, these can be adjusted through negotiations between Hyundai-Kia Motor's design engineer and suppliers.

All samples, which are randomly selected inspected parts from the prototype process and the production process (including the pilot process), must meet this standard. The relevant supplier must establish a reliability verification system on its own to qualify the design of the part with a sufficient number of samples.

The requirements in this standard are described as follows:

• All components and plating materials used in soldering and electronic components must contain 0,09 weight percent (900 ppm) or less of lead.
• Suppliers must submit a test report prepared in accordance with the attached report form.
• The test voltage for all tests shall be 12,6 Volts plus/minus 0,2 Volts. If the voltage specified in the ES specification for the electronic packaging and assembly process differs from this specification, the ES specification shall be followed.
• For resin molded components of 2 mm or more, whisker inspection and bond strength testing may be excluded.
• In principle, the tests in this specification should be carried out at the proto stage, and if changes are made, the test items should be determined in consultation with the design engineer of Hyundai-Kia Motor Company. In case of changes in the production plant, soldering method, soldering material and printed circuit board material, in principle, the tests should be re-performed.

Reliability test items In order to ensure the reliability of the electronic packaging and assembly process and facilitate their testing, electronic packaging and assembly processes are divided into two types as in the table titled “Classification of electrical/electronic subassembly” given in the standard, and the tests are carried out according to the reliability test items and procedures according to the type.

The test methods defined in this standard include:

• Thermal shock test: The purpose of this test is to test the damage at the soldering joint area caused by the difference in expansion coefficient of components and circuit boards due to temperature change and the durability reliability of components (electrical/electronic components and printed circuit board).
• Power and temperature cycling test: The purpose of this test is to check whether there is damage to the components (printed circuit board, electronic component and solder) due to temperature change and whether the electronic packaging and assembly process shows failure.
• Vibration endurance test: This test is done by two different methods:
  • The purpose of vibration test by operation is to test the durability reliability in vibration environment (the scope of application is indoor, trunk and inner door installed).
  • The purpose of complex environmental durability test is to test the durability reliability in vibration environment (the scope of application is outdoor and machine room installation)
• High temperature and high humidity endurance test: The purpose of this test is to test the insulation between circuits (ion migration and whisker) and the endurance reliability of components (electrical/electronic component and printed circuit board) in high temperature and high humidity environment.
• Whisker inspection: The purpose of this test is to examine whisker growth on terminal and soldering areas of electrical and electronic components.
• Section inspection: The purpose of this test is to check the deterioration of the soldering area after the reliability test.
• Bond strength test 1 (surface mounted component): The purpose of this test is to inspect the solder joint strength of Surface mounted components after reliability testing.
• Joint strength test 2 (wire soldering component): the purpose of this test is to test the joint strength of wire soldering components.

The supplier's ES test plan document including detailed test procedures (test method, equipment) must be submitted within 1 month after the proto drawing or complete drawing is issued and within 1 month before mass production molding begins.

Testing is usually done for all specifications, but for parts with extreme specifications, testing can be done for some representative specifications. Suppliers will consider the vehicle/region/setting to meet all the objectives of the tests and determine the parts to be tested first. Final test specifications are then determined after discussion with Hyundai-Kia Motor Company engineering design teams for validity. In addition, suppliers should establish their own reliability systems and conduct preliminary inspections to ensure that the parts meet the specifications under all conditions. If necessary, the number of samples specified in the specification can be increased.

Our organization has a strong staff that closely follows the developments in the world in the field of science and technology and constantly improves itself. Among the numerous test, measurement, analysis and evaluation studies provided for businesses in various sectors, there are also testing services within the scope of the "KIA ES90000-04 Alternative joining material to tin/lead alloy" standard.